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Books › "The Mechanics Of Solder Alloy Interconnects"

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1. 
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Handbook of Thick- and Thin-film Hybrid Microelectronics by Tapan K. Gupta (Hardcover - 13 May 2003)
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Excerpt - page 271: " ... New York, 1993. 32. D. Fear, H. Morgan, S. Burcht, and J. H. Lau, The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, New York, 1993. 33"
2. 
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The Mechanics of Solder Alloy Interconnects (Electrical Engineering) by Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, and John H. Lau (Hardcover - 31 Jan 1994)
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Excerpt - Front Matter: "Mechanics of Solder Alloy Interconnects Edited by D. R. Frear S. N. Burchett H. S. Morgan"
3. 
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Solder Joint Reliability of BGA, CSP and Flip Chip Assemblies (Electronic Packaging & Interconnection Series) by John H. Lau and Yi-Hsin Pao (Hardcover - 1 Sep 1996)
6 Used & new from £28.43
Excerpt - page 10: " ... Morgan, S. Burchett, and J. H. Lau, The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, New York, 1993. 8. Lau, J. H., Solder Joint Reliability: Theory and Applications ... "
4. 
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BALL GRID ARRAY TECHNOLOGY (Electronic Packaging and Interconnection) by John H. Lau (Hardcover - 1 Dec 1994)
2 Used & new from £109.47
Excerpt - page 58: "Lau, The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, New York, 1993. 16. Lau, J. H., Chip On Board Technologies for Multichip Modules, Van ... "
5. 
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Flip Chip Technologies (Electronic Packaging and Interconnection) by John H. Lau (Hardcover - 1 Dec 1995)
3 Used & new from £83.11
Excerpt - page 76: " ... Hill, New York, 1995. 3. Frear, D., H. Morgan, S. Burchett, and J. H. Lau, The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, New York, 1993. 4. Lau ... "
6. 
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Chip on Board: Technology for Multichip Modules (E; Ectrical Engineering) by John H. Lau (Hardcover - 30 Jun 1994)
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Excerpt - page 88: "Solder Joint Reliability: Theory and Applications, Van Nostrand Reinhold, New York, 1991. 16. Frear, D., H. Morgan, S. Burchett, and J. Lau, The Mechanics of Solder Alloy ... "
 
  
 

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