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Principles of Plasma Discharge for Materials Processing
 
 
Principles of Plasma Discharge for Materials Processing (Hardcover)
by Michael A. Lieberman (Author), Allan J. Lichtenberg (Author) "The plasma medium is complicated in that the charged particles are both affected by external electric and magnetic fields and contributes to them ..." (more)
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Product details
  • Hardcover: 600 pages
  • Publisher: John Wiley & Sons (29 Nov 1994)
  • Language English
  • ISBN-10: 0471005770
  • ISBN-13: 978-0471005773
  • Product Dimensions: 24.3 x 16.4 x 3.4 cm
  • Average Customer Review: 5.0 out of 5 stars  (3 customer reviews)
  • Amazon.co.uk Sales Rank: 1,957,809 in Books (See Bestsellers in Books)

    Popular in these categories:

    #49 in  Books > Scientific, Technical & Medical > Physics > Plasma Physics
    #49 in  Books > Science & Nature > Physics > States of Matter > Plasma

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  • Other Editions: Hardcover (2nd Edition) |  All Editions

  • See Complete Table of Contents

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Product Description
Product Description
Timely, authoritative, pedagogically consistent— a valuable professional resource and a superior didactic tool. Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, lowpressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications—especially in the fabrication of integrated circuits. With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource.
  • Indepth coverage of the fundamentals of plasma physics and chemistry—includes separate chapters on atomic and molecular collisions
  • Applies basic theory to plasma discharges, including calculations of plasma parameters and scaling of plasma parameters with control parameters
  • Applies results to basic processing mechanisms and the effects of plasma parameters on those mechanisms
  • Uses numerous worked examples to demonstrate the relationships between control parameters, plasma parameters, and processing results


Synopsis
Timely, authoritative, pedagogically consistent - a valuable professional resource and a superior didactic tool. Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications - especially in the fabrication of integrated circuits. With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource.

* In-depth coverage of the fundamentals of plasma physics and chemistry - includes separate chapters on atomic and molecular collisions* Applies basic theory to plasma discharges, including calculations of plasma parameters and scaling of plasma parameters with control parameters* Applies results to basic processing mechanisms and the effects of plasma parameters on those mechanisms* Uses numerous worked examples to demonstrate the relationships between control parameters, plasma parameters, and processing results

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Inside This Book (Learn More)
First Sentence
The plasma medium is complicated in that the charged particles are both affected by external electric and magnetic fields and contributes to them. Read the first page
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Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
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