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Principles of Plasma Discharge for Materials Processing
 
 
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Principles of Plasma Discharge for Materials Processing (Hardcover)

by Michael A. Lieberman (Author), Allan J. Lichtenberg (Author) "The plasma medium is complicated in that the charged particles are both affected by external electric and magnetic fields and contributes to them ..." (more)
5.0 out of 5 stars  See all reviews (3 customer reviews)

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Product details

  • Hardcover: 600 pages
  • Publisher: John Wiley & Sons (29 Nov 1994)
  • Language English
  • ISBN-10: 0471005770
  • ISBN-13: 978-0471005773
  • Product Dimensions: 24.3 x 16.4 x 3.4 cm
  • Average Customer Review: 5.0 out of 5 stars  See all reviews (3 customer reviews)
  • Amazon.co.uk Sales Rank: 1,640,222 in Books (See Bestsellers in Books)

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Product Description

Product Description

Timely, authoritative, pedagogically consistent— a valuable professional resource and a superior didactic tool. Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low–pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications—especially in the fabrication of integrated circuits. With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource.
  • In–depth coverage of the fundamentals of plasma physics and chemistry—includes separate chapters on atomic and molecular collisions
  • Applies basic theory to plasma discharges, including calculations of plasma parameters and scaling of plasma parameters with control parameters
  • Applies results to basic processing mechanisms and the effects of plasma parameters on those mechanisms
  • Uses numerous worked examples to demonstrate the relationships between control parameters, plasma parameters, and processing results


From the Back Cover

Timely, authoritative, pedagogically consistent— a valuable professional resource and a superior didactic tool. Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low–pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications—especially in the fabrication of integrated circuits. With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource.
  • In–depth coverage of the fundamentals of plasma physics and chemistry—includes separate chapters on atomic and molecular collisions
  • Applies basic theory to plasma discharges, including calculations of plasma parameters and scaling of plasma parameters with control parameters
  • Applies results to basic processing mechanisms and the effects of plasma parameters on those mechanisms
  • Uses numerous worked examples to demonstrate the relationships between control parameters, plasma parameters, and processing results
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Inside This Book (Learn More)
First Sentence
The plasma medium is complicated in that the charged particles are both affected by external electric and magnetic fields and contributes to them. Read the first page
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Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
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Customer Reviews

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Average Customer Review
5.0 out of 5 stars (3 customer reviews)
 
 
 
 
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Most Helpful Customer Reviews

 
5.0 out of 5 stars The book provides an excellent overview of plasma processing, 10 Dec 1998
By A Customer
This book provides an excellent introduction and overview of plasma discharges applied to semiconductor manufacturing. It is well-organized, clearly-written and full of useful examples and exercises. And unlike many books on plasma physics, it is not overly-mathematical and contains many useful physical insights. I strongly recommend this book for anyone wanting to review the field of plasma processing.
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5.0 out of 5 stars An excellent overview of common plasma processing devices, 10 Dec 1998
By A Customer
Lieberman covers many of the standard processing devices and much of the physics needed to model them effectively.

The presentation is clear and extremely useful both as a reference and as a tutorial. A must-have book for anyone interested in plasma processing.

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5.0 out of 5 stars Very Good Theoretical Coverage of Plasma's, including ECR, 1 May 1998
By A Customer
This book provides a theoretical overview of plasma's, including coverage of ECR applications. This was very valuable for Hitachi Etchers. The theory is presented at an undergraduate level and assumes the reader has knowledge of vector analysis. Highly recommended for any Etch Process Engineer in the Semiconductor Industry.
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