Product Description
This is the only book to teach microsystems packaging - written by the field's leading author. This is the book that engineers, technicians, and students want - the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop "Fundamentals to Microsystems Packaging" covers the field from wafer to systems, including every major contributing technology. It's the only book to do so.This much-needed tool features: a comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems; rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology; easy-to-read schematics and block diagrams; fundamental approaches to all system issues; examples of all common configurations and technologies - wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others; details on chip-to-board connections, sealing and encapsulation, and manufacturing processes; basics of electrical and reliability testing; hundreds of explanatory two-color illustrations; self-test problems and solutions in every chapter; and, glossary. This title provides the best way to learn microsystems packaging through self-study or in a classroom - and the most comprehensive on-the-job reference. It covers MICROSystems packaging from the ground up.
Book Description
This is an interdisciplinary tutorial designed for electrical, mechanical, chemical, and materials engineers working in the electronic packaging fields. Each chapter covers a major packaging technology according to a master gird, so all chapters follow an identical format. Each chapter includes schematics and block diagrams, problems and solutions, and details the impact of each technology on electrical, materials, chemical, and mechanical tracks.
Key Features:
*Star-studded author tream led by Tummala, the biggest name in the field
*Two color throughout
*Each technology detailed for electrical, mechanical, chemical, and materials aspects
