The problem with the book is that it is not a book at all: it is a collection of 12 articles which vary enormously in their style and level. Some are excellent, like Richard Fair's RTP chapter, but many are run-of-the-mill reviews. A welcomed addition is that wafer cleaning and clean room technology have chapters of their own, usually they tend to be regarded as side issues. Editors have not syncronized the chapters: planarization is discussed twice: in both CVD and process integration chapters and silicides three times: in RTP, metallization and process integration.
The book is not specifically about ULSI: it is a general overview of silicon (mostly MOS) process technologies, or at least I do not consider molecular beam epitaxy, contact lithography or bias sputtered quartz as ULSI technologies. Maybe this is for textbook completeness, but then why is oxidation absent ?
The intended audience of this book remains a mystery to me: in the preface it is described as a textbook (for senior undergraduates or first year graduate students) but the structure of the book does not support a fabrication course because many essential items have been left out: e.g. oxidation and ion implantation.
Most chapters contain 50-100 references to literature, but to old literature: process integration chapter ("totally revised and updated") average date of references is 1987, with only a handful of 1990's articles.