These are the most frequently used words in this book.
adhesive
analysis
applications
area
assembly
between
board
card
case
cca
ceramic
circuit
components
conductor
constant
copper
cost
design
dielectric
due
during
electrical
electronic
environmental
equipment
example
failure
fatigue
fig
figure
film
form
frequency
ground
heat
high
holes
impedance
increase
laminates
laser
layers
life
line
loss
low
materials
may
metal
method
microvia
minimum
model
must
package
pad
part
paste
performance
plane
plating
power
printed
problems
process
product
properties
pwb
reliability
require
required
resist
resistance
result
section
should
shown
signal
since
size
solder
strength
stress
structure
substrate
surface
system
table
technology
temperature
thermal
thickness
time
tion
two
type
use
used
value
vias