- Hardcover: 450 pages
- Publisher: McGraw-Hill Inc.,US (1 Jun 2001)
- Language English
- ISBN-10: 0071363270
- ISBN-13: 978-0071363273
- Product Dimensions: 23.6 x 16.3 x 4.5 cm
- Amazon Bestsellers Rank: 2,831,709 in Books (See Top 100 in Books)
- See Complete Table of Contents
Microvias
and over 900,000 other books are available for Amazon Kindle .
Learn more
| |||||||||||||||
Did you know you can trade in your old books for an Amazon.co.uk Gift Card to spend on the things you want? Visit the Amazon.co.uk Trade-In Store for more details. |
Product details |
More About the Author
Product Description
Product Description
A guide to microvias technology. It covers technology basics, design methods, heat concerns and developments, and surveys companies and products. Microvias products are essential to small mobile phones and other handheld electronic products, otherwise they would be twice their current size.
From the Back Cover
The first comprehensive and in-depth guide to microvia and wafer level chip scale package (WLCSP) technologies. This reference gives you cutting edge information on the most important developments and latest research results in applying the microvia and WLCSP technologies to low-cost and high-density interconnects. For professionals active in microvia and WLCSP research and development, those who wish to master microvia and WLCSP problem solving methods, and those demanding a cost-effective design and high-yield manufacturing process for their low-cost and high-density interconnect systems, here is up-to-the-minute coverage of all aspects of this fascinating field.
This one-stop guide meets the reference needs of design, materials, process, equipment, manufacturing, reliability, component, packaging, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. With this book you will develop a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of microvia and WLCSP technologies. Among the topics explored:
-
-IC trends and their packaging technology updates
-Design, materials, imaging, drilling, plating, etching, solder resist, machining, and routing of conventional PCB technologies
-Mechanical drilling for microvias
-Materials, mechanisms, tools, and processes for making microvias with Excimer, UC:YAG, and CO2 laser drilling
-Microvias formed by various photoimageable dielectrics and fine-line lithography
-Chemical- and plasma-etched microvias
-Conductive paste/ink-filled microvias
-Thin-film high-density interconnects for WLCSP applications
-Solders for the next generation of WLCSPs
-Creep of solders under combined loads
-Low-alpha-particle-bearing solders
-Lead-free solders
-Wafer bumping (by electroplating and stencil printing methods) with lead-free solders
-Assembly of flip chip on high-density PCBs or substrates with reworkable underfills and with no-flow underfills
-Solder-joint reliability of WLCSP on microvia build-up or substrates
Microvias: For Low-Cost and High-Density Interconnects is required reading for the electronic packaging industry. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use this book, you will see why it is the resource of choice for the field's leaders.
Inside This Book
(Learn More)
First Sentence
The semiconductor industry is firing on all cylinders. Read the first page
Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
The semiconductor industry is firing on all cylinders. Read the first page
Explore More
Concordance
Browse Sample PagesConcordance
Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
Tag this product(What's this?)Think of a tag as a keyword or label you consider is strongly related to this product.
Tags will help all customers organise and find favourite items. |
Customer Reviews
|
There are no customer reviews yet on Amazon U.K.
|
||||||||||||||||||||
|
Most Helpful Customer Reviews on Amazon.com (beta)
Amazon.com:
5.0 out of 5 stars (2 customer reviews)
5.0 out of 5 stars
Useful overview of topics, 25 July 2001
By K.L. Jim - Published on Amazon.com
This review is from: Microvias: Low Cost, High Density Interconnects (Electronic Packaging and Interconnection) (Hardcover)
This book gives an excellent review of microvias and WLCSP technologies, with real-world examples from the electronic packaging industry. It focuses largely on how to create effective & reliable low-cost, high density interconnects in modern high speed system designs. It provides a sufficient amount of theory so that the the reader can understand the fundamental issues assosiated with high density interconnection. It's a comprehensive book with the ability to keep you satisfied no matter what you are looking for.
0 of 2 people found the following review helpful:
5.0 out of 5 stars
Useful overview of topics, 25 July 2001
By K.L. Jim - Published on Amazon.com
This review is from: Microvias: Low Cost, High Density Interconnects (Electronic Packaging and Interconnection) (Hardcover)
This book gives an excellent review of microvias and WLCSP technologies, with real-world examples from the electronic packaging industry. It focuses largely on how to create effective & reliable low-cost, high density interconnects in modern high speed system designs. It provides a sufficient amount of theory so that the the reader can understand the fundamental issues assosiated with high density interconnection. It's a comprehensive book with the ability to keep you satisfied no matter what you are looking for.
Customer Discussions
|
This product's forum
Active discussions in related forums
Search Customer Discussions
|
Related forums
|
Listmania!
Look for similar items by category
- Books > Children's Books > Education > Subjects
- Books > Computing & Internet > Networking & Security
- Books > Science & Nature > Engineering & Technology > Electrical
- Books > Science & Nature > Engineering & Technology > Electronics & Communications Engineering > Electronics Engineering > Circuits
- Books > Science & Nature > Engineering & Technology > Electronics & Communications Engineering > Other Electronic Devices
- Books > Science & Nature > Engineering & Technology > Electronics & Communications Engineering > Telecommunications
- Books > Science & Nature > Physics > Electromagnetism
- Books > Scientific, Technical & Medical
Look for similar items by subject
Feedback
- Would you like to update product info or give feedback on images?
- I am the Author, and I want to comment on my book.
- I am the Publisher, and I want to comment on this book.
