Electronic Packaging and Interconnection Handbook [Hardcover]

Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies. (Sci-Tech Book News ) --This text refers to an alternate Hardcover edition.

This edition features new material covering the new generation of packaging technologies transforming the industry.

The field's only comprehensive reference

MEMs packaging

Optoelectronic packaging

Ball grid array, flip chip, and direct chip attach --This text refers to an alternate Hardcover edition.

THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING—COMPLETELY UPDATED

From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies.

Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others.

Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal.

Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including:

• Materials
• Thermal Management
• Shock, Vibration, and Operational Stress Management
• Connector and Interconnection Technologies
• Soldering and Cleaning Technologies
• Single Chip Packaging and Ball Grid Arrays
• Surface Mount Technology
• Hybrid and Multichip Modules
• Chip-Scale, Flip-Chip, and Direct-Chip Attachment
• Rigid and Flexible Printed-Wiring Boards
• Packaging High-Speed and Microwave Systems
• Packaging High-Voltage Systems
• Packaging of MEMs Systems
• Packaging of Optoelectronic Systems --This text refers to an alternate Hardcover edition.

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronocs industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.