- Hardcover: 520 pages
- Publisher: McGraw-Hill Publishing Co.; illustrated edition edition (1 Mar 1999)
- Language English
- ISBN-10: 0070410445
- ISBN-13: 978-0070410442
- Product Dimensions: 24.1 x 19.5 x 5.5 cm
- Amazon Bestsellers Rank: 3,325,417 in Books (See Top 100 in Books)
- See Complete Table of Contents
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More About the Author
Product Description
Product Description
This book is intended for electronic parts suppliers, systems designers, and fabricators - to help protect against product and system failure. It features: components ranging from microelectronics to wires and cables; a wealth of case studies; extremely comprehensive coverage of the entire industry.
From the Author
Yes, I admit it, I'm proud to say; "I work with failures!"
Throughout the school years, Scientists and Engineers are taught how and why things work. In my experience it is rare to ever get more than a short anecdote about the failures(why things don't work), yet this is where the real learning, the growth, occurs. People learn by making mistakes and taking corrective actions so that the same mistakes will not be made again. We say that people mature. Manufacturing processes can mature in a similar manner. The semiconductor/microelectronics industry embraced this philosophy and incorporated microelectronic failure analysis into the corporate culture. The result was miraculous increases in product reliability. The achievements of the microelectronics industry were admired by other electronics-related companies and, to some extent, duplicated. Electronic failure analysis is now common across a broad range of companies and electronics technologies yet it is difficult to find any documentation of these efforts. The Electronic Failure Analysis Handbook is an attempt to address this deficiency. The Electronic Failure Analysis Handbook is presented in three parts: Part One is the shortest and deals with the uses of electronic failure analysis (EFA). Background on system and component reliability is presented, as well as an entire chapter on the use of EFA in product liability. Part Two deals with the techniques involved in performing EFA. Techniques include: electrical charaterization, x-ray, IR-thermography, acoustic micro-imaging, photography, metallography, etc.. Efforts are made to present information to allow optimization of these techniques for specific technologies. Part Three deals with the failure analysis of specific technologies. This includes: Microelectronics, passive components, connectors, solder joints, switches, high-voltage applications, etc.. The intent is to be as inclusive as possible. I would not attempt to develop such a comprehensive undertaking alone. I called upon the leading experts in their fields to contribute chapters to the handbook and case studies & examples are presented and featured in all three parts of the handbook. These experts did a wonderful job of presenting the material in a useful format. I believe that this handbook will be a valuable addition to the library of anyone who works in or around electronics. I sincerely hope that it serves you well.
Throughout the school years, Scientists and Engineers are taught how and why things work. In my experience it is rare to ever get more than a short anecdote about the failures(why things don't work), yet this is where the real learning, the growth, occurs. People learn by making mistakes and taking corrective actions so that the same mistakes will not be made again. We say that people mature. Manufacturing processes can mature in a similar manner. The semiconductor/microelectronics industry embraced this philosophy and incorporated microelectronic failure analysis into the corporate culture. The result was miraculous increases in product reliability. The achievements of the microelectronics industry were admired by other electronics-related companies and, to some extent, duplicated. Electronic failure analysis is now common across a broad range of companies and electronics technologies yet it is difficult to find any documentation of these efforts. The Electronic Failure Analysis Handbook is an attempt to address this deficiency. The Electronic Failure Analysis Handbook is presented in three parts: Part One is the shortest and deals with the uses of electronic failure analysis (EFA). Background on system and component reliability is presented, as well as an entire chapter on the use of EFA in product liability. Part Two deals with the techniques involved in performing EFA. Techniques include: electrical charaterization, x-ray, IR-thermography, acoustic micro-imaging, photography, metallography, etc.. Efforts are made to present information to allow optimization of these techniques for specific technologies. Part Three deals with the failure analysis of specific technologies. This includes: Microelectronics, passive components, connectors, solder joints, switches, high-voltage applications, etc.. The intent is to be as inclusive as possible. I would not attempt to develop such a comprehensive undertaking alone. I called upon the leading experts in their fields to contribute chapters to the handbook and case studies & examples are presented and featured in all three parts of the handbook. These experts did a wonderful job of presenting the material in a useful format. I believe that this handbook will be a valuable addition to the library of anyone who works in or around electronics. I sincerely hope that it serves you well.
Inside This Book
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First Sentence
Failure analysis is the process of determining the cause of failure, collecting and analyzing data, and developing conclusions to eliminate the failure mechanism causing specific device or system failures. Read the first page
Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
Failure analysis is the process of determining the cause of failure, collecting and analyzing data, and developing conclusions to eliminate the failure mechanism causing specific device or system failures. Read the first page
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Concordance
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Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
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Customer Reviews
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Most Helpful Customer Reviews on Amazon.com (beta)
Amazon.com:
5.0 out of 5 stars (4 customer reviews)
6 of 7 people found the following review helpful:
5.0 out of 5 stars
The "Bible" in Failure Analysis, 15 Nov 2001
By Clavius Chin "cclavius" - Published on Amazon.com
This review is from: Electronic Failure Analysis Handbook (Electronic packaging and interconnection series) (Hardcover)
After I read this book, I passed it to my Engineers, and afterwhich I never have a chance to access it anymore, as both my Engineers just won't let go!This is indeed "THE BIBLE" for Failure Analysis. It covers most of the techniques needed for each type of FA, like X-ray imaging, SAM, Thermal imaging, Metallography, Chemical Characterization, SEM/EDX, and Electronic Failures. The best of it all is that in Part 2, it is organized in terms of equipment techniques; in part 3, it is organized in terms of products, like PCB, PCBA, connection, component, etc. As such it give you the flexibility either go to Part 2 and learn about how and what types of failure analysis a particular equipment can perform, or go to Part 3 and find out the sequence of which equipments is to used first for a particular failure mode.
However, I need to highlight that the though there are tons of photos in the book, the quality of the photos need lots of improvement. Many a times, it takes me long time to figure out what's in the photos. Maybe some highlights or markings at the particular spot of interest in the comparison of the photos would help some novice readers to appreciate better
7 of 9 people found the following review helpful:
5.0 out of 5 stars
GOOD STUFF!, 23 Mar 2000
By A Customer - Published on Amazon.com
This review is from: Electronic Failure Analysis Handbook (Electronic packaging and interconnection series) (Hardcover)
The best thing I can say about this book is that I use it every day. Well organized and easy to use. Well done
1 of 1 people found the following review helpful:
5.0 out of 5 stars
Enlightening, 5 Jun 2009
By Paolo Giai Miniet - Published on Amazon.com
This review is from: Electronic Failure Analysis Handbook (Electronic packaging and interconnection series) (Hardcover)
We are really dealing with a first class book on the subject. In it you can find a lot of greatly useful informations about F.A. from the testing techniques to the study cases.
To me, what I found impressive is the detailed description of the analysis testing techniques covering the technology description of them and the correct case in which recall them.
For sure a book that you will find helpful. Well spent money!
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