These are the most frequently used words in this book.
alloys
applications
area
beam
between
board
cable
characteristics
circuit
conditions
conductivity
conductor
connections
connector
considerations
contact
copper
corrosion
courtesy
crimp
crimped
current
deformation
depends
design
discussed
due
during
effect
electrical
environment
example
exposure
fig
figure
films
finishes
force
fretting
generally
geometry
gold
heat
high
higher
hole
housing
however
important
incorporated
increases
insulation
interface
level
materials
mating
may
mechanical
metal
must
nickel
normal
number
percent
performance
permanent
pin
polymer
process
properties
provide
pth
pwb
range
requirements
resistance
result
section
should
signal
size
solder
soldering
stability
strength
stress
surface
system
technology
temperature
test
thermal
thickness
tin
two
types
use
used
wear
wire