- Hardcover: 424 pages
- Publisher: John Wiley & Sons (13 Feb 1996)
- Language English
- ISBN-10: 0471017558
- ISBN-13: 978-0471017554
- Product Dimensions: 24.3 x 16.4 x 2.6 cm
- Average Customer Review: 1.0 out of 5 stars See all reviews (1 customer review)
- Amazon Bestsellers Rank: 3,600,749 in Books (See Top 100 in Books)
- See Complete Table of Contents
Design and Analysis of Heat Sinks
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Product Description
Product Description
A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . .
Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost–effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.
Other topics covered include:
∗ Fundamentals of heat transfer
∗ Thermal modeling of electronic packages
∗ Mathematical tools for heat–sink analysis and design
∗ Prevailing thermal transport processes
∗ Models for a variety of fin geometries
∗ Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks
∗ Thermal characterization and optimization of plate–fin heat sinks
Completely self–contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost–effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.
Other topics covered include:
∗ Fundamentals of heat transfer
∗ Thermal modeling of electronic packages
∗ Mathematical tools for heat–sink analysis and design
∗ Prevailing thermal transport processes
∗ Models for a variety of fin geometries
∗ Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks
∗ Thermal characterization and optimization of plate–fin heat sinks
Completely self–contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
From the Back Cover
A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . .
Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost–effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities.
Other topics covered include:
- Fundamentals of heat transfer
- Thermal modeling of electronic packages
- Mathematical tools for heat–sink analysis and design
- Prevailing thermal transport processes
- Models for a variety of fin geometries
- Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks
- Thermal characterization and optimization of plate–fin heat sinks
Completely self–contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
Inside This Book
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First Sentence
This book is devoted to the heat sink which is used to enhance heat transfer from the surface of an electronic component or package to the surrounding environment. Read the first page
Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
This book is devoted to the heat sink which is used to enhance heat transfer from the surface of an electronic component or package to the surrounding environment. Read the first page
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Concordance
Browse Sample PagesConcordance
Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
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Most Helpful Customer Reviews
1.0 out of 5 stars
Too much theory, not enough application,
By A Customer
This review is from: Design and Analysis of Heat Sinks (Thermal Management of Microelectronic and Electronic System Series) (Hardcover)
As an electronics packaging engineer, I really get tired of getting the runaround from the heatsink companies and was hoping to find a book that gave me a straight-forward process for physically designing a heatsink. Instead I found myself falling asleep in front of a text that gave me flashbacks to my college years. I realize that theory is valuable, but if it is not put to the test it is worth no more than the paper on which it is written. The amount of practical insight in this book was derived from references and was enough to fit in a thimble. Examples were few and far between and although written like a textbook, there were no problems to work through to cement the theory. Face it John Wiley & Sons, this book should have been named "Theory of Heatsink Design and Analysis". The academicians will love it, but for those of us with our feet on the floor and noses to the grindstone...forget this one!
Share your thoughts with other customers: Create your own review
Most Helpful Customer Reviews on Amazon.com (beta) Amazon.com:
2.3 out of 5 stars (3 customer reviews) 11 of 13 people found the following review helpful:
1.0 out of 5 stars
Too much theory, not enough application,
By frozen.arguellos@worldnet.att.com - Published on Amazon.com
This review is from: Design and Analysis of Heat Sinks (Thermal Management of Microelectronic and Electronic System Series) (Hardcover)
As an electronics packaging engineer, I really get tired of getting the runaround from the heatsink companies and was hoping to find a book that gave me a straight-forward process for physically designing a heatsink. Instead I found myself falling asleep in front of a text that gave me flashbacks to my college years. I realize that theory is valuable, but if it is not put to the test it is worth no more than the paper on which it is written. The amount of practical insight in this book was derived from references and was enough to fit in a thimble. Examples were few and far between and although written like a textbook, there were no problems to work through to cement the theory. Face it John Wiley & Sons, this book should have been named "Theory of Heatsink Design and Analysis". The academicians will love it, but for those of us with our feet on the floor and noses to the grindstone...forget this one!
2 of 2 people found the following review helpful:
1.0 out of 5 stars
Impractical,
By Michael C. Lade - Published on Amazon.com
This review is from: Design and Analysis of Heat Sinks (Thermal Management of Microelectronic and Electronic System Series) (Hardcover)
I used this book, along with Mathcad and Excel, for a 1st-pass design.
The result was a design that didn't pass the "sanity check" (fin dimensions so large as to make them impractical). Note I double-checked my results, retracing the steps thoroughly. For a subsequent design I returned to the methods presented in the book I used for my senior-level heat transfer class (Kays and Crawford, Convective Heat and Mass Transfer), which required much less time and effort. In my opinion: 1) It takes too much time and effort to understand the theory in the book, which is required in order to use the mathematics presented; 2) The book should include practical examples of how to use the technique(s) presented; 3) There should be a thorough presentation of how the technique(s) were validated; 4) This book does not present a practical (real world) method for heat sink design. 3 of 5 people found the following review helpful:
5.0 out of 5 stars
A good read for the new economy engineer,
By A Customer - Published on Amazon.com
This review is from: Design and Analysis of Heat Sinks (Thermal Management of Microelectronic and Electronic System Series) (Hardcover)
If you need to know the ins-and-outs of designing heatsinks -- then this is a must read.I found the diagrams and examples useful. If you are a beginner, as perhaps the previous reviewer is, then yes, there are not enough problems to work through and it would have been nice to see less theory and more real-world examples. all in all you can't go wrong reading this book. |
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