First Sentence
In the design of packages of electronic components there are strong incentives to mount as much circuity as possible in a given space. Read the first page
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These are the most frequently used words in this book.
1990
1994
air
al
analysis
application
approach
area
array
based
bejan
between
blocks
board
boundary
case
channel
chip
circuit
coefficient
components
conduction
conductivity
conjugate
convection
convective
cooling
correlation
data
design
developed
downstream
drop
effect
electronic
element
enhancement
equation
et
figure
first
flow
fluid
flux
forced
fully
function
geometry
heat
heated
height
increase
int
jet
laminar
layer
length
limit
mass
maximum
may
mm
model
modules
natural
number
optimal
package
parameters
plate
point
power
pressure
problem
rate
re
results
reynolds
row
section
shown
shows
side
solution
source
spacing
substrate
surface
system
technology
temperature
thermal
transfer
turbulent
two
used
value
velocity
wake
wall
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