- Hardcover: 272 pages
- Publisher: CRC Press (26 April 1996)
- Language English
- ISBN-10: 0849394473
- ISBN-13: 978-0849394478
- Product Dimensions: 24.3 x 16.3 x 2.1 cm
- Amazon Bestsellers Rank: 3,604,435 in Books (See Top 100 in Books)
- See Complete Table of Contents
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Product Description
Product Description
Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics.
Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling?
The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling?
The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Inside This Book
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First Sentence
In the design of packages of electronic components there are strong incentives to mount as much circuity as possible in a given space. Read the first page
Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
In the design of packages of electronic components there are strong incentives to mount as much circuity as possible in a given space. Read the first page
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Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
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Amazon.com:
3.0 out of 5 stars (1 customer review)
2 of 2 people found the following review helpful:
3.0 out of 5 stars
A mixture of technical & understandable information, 12 Sep 2000
By Adam S. Sharp - Published on Amazon.com
This review is from: Air Cooling Technology for Electronic Equipment (Hardcover)
This book is a fairly useful resource for those interested in air cooling. Although it put me to sleep, there is some pretty good information. The six chapters were each composed by a different person or group and thus each have different technical content. The first few chapters contain a lot of technical information and require a very strong mathematical background to fully comprehend. These chapters can still yield some basic helpful information with a cursory read. Some of the other chapters leave the equations out of it and convey some beneficial in a 'rule of thumb' sort of way. Overall, I found it dry but beneficial. I believe it would be even more helpful to those involved in circuit board cooling.
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