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Advanced Electronic Packaging: Volume 968 (MRS Proceedings) Paperback – 5 Jun 2014


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Product details

  • Paperback: 218 pages
  • Publisher: Cambridge University Press (5 Jun. 2014)
  • Language: English
  • ISBN-10: 1107408784
  • ISBN-13: 978-1107408784
  • Product Dimensions: 15.2 x 1.2 x 22.9 cm

Product Description

Book Description

Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologies. The book focuses on silicon technology dimension scaling and performance improvement, Pb-free or 'green' assembly, and system-in-package (SIP) technologies.

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