These are the most frequently used words in this book.
0
1000
above
against
areas
between
board
bonding
bs
cable
circuit
conditions
conductor
conduit
contact
cpc
current
design
details
device
distribution
drop
earth
effect
electrode
enclosures
equipment
etc
example
factors
fault
figure
final
following
fuse
give
hence
high
ib
impedance
installation
instrument
insulation
ip
lamps
less
lighting
live
locations
loop
ma
main
maximum
may
method
mm
mm2
must
need
outlets
parts
phase
protection
protective
pvc
r2
rcd
reading
regulations
requirements
resistance
ring
risk
section
shock
should
shower
singles
size
socket
supply
switch
system
table
tabulated
tee
temperature
test
time
trunking
type
unit
use
used
value
voltage
water
wiring
zone
zs